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    AGL Magazine

    PIM Requirements for Low Power Wireless Components and Subsystems

    Microlab

    Posted  March 14, 2014

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    Passive intermodulation, PIM, continues to be a concern for high speed Wireless networks. A good understanding of how it impacts the network operation and how to detect and avoid it has been rapidly developing. This has reflected in PIM testing procedures and limits for high power RF components and subsystems. As these specifications were mostly geared towards high power, +40 W applications and components, there is a need to address the low power PIM requirements as such systems are playing a bigger role in new roll outs. We attempt to define here those reasonable limits.

    Microwave Journal

    Passive Intermodulation Characteristics

    Microlab

    Posted  March 14, 2014

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    Passive Intermodulation Characteristics Microwave Journal

    The art and science of radio hardware design has been to some degree about minimizing, avoiding and, if possible, altogether eliminating unwanted spurious signals that find their way into the receive path of a radio. Typical sources of such signals are usually the multitude of two or more terminal devices that contain active semiconductor junctions such as diodes, transistors and ICs made up of them. These junctions with their nonlinear current voltage characteristics can be a rich source of harmonics and various intermodulation products, especially if more than one signal is present across them. Though magnetic materials commonly encountered in electronic circuits of most kinds are also a potential source of such nonlinearities, these components are usually used in blocking low level, low frequency ripples and occasional spikes in voltage or current and rarely interfere with communication signals unless poorly designed and selected.


    DAS Group Professionals

    Big Four Sign On to Levi's DAS and Construction Starts Ahead of Schedule

    Microlab

    Posted  January 6, 2014

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    When 68,500 San Francisco 49ers fans pour into the new Levi's Stadium next fall, it's likely their smartphones will go into overdrive as they Twitter, text, share photos and make phone calls to prove they were there on opening day.

    Microwave Engineering Europe

    DAS carrier conditioners for both in-building and outdoor applications

    Microlab

    Posted  December 5, 2012

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    Microlab is introducing a product line for both in-building and outdoor DAS applications, the DCC Series™ DAS carrier conditioners. These products are equally suited for passive DAS venues and for active fiber DAS installations.

    Microwave Journal

    Wireless Telecom Group offers new line of DAS Carrier Conditioners

    Microlab

    Posted  December 4, 2012

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    Microwave Journal Cover

    Microlab, a Wireless Telecom Group company,is introducing a new product line for both in-Building and outdoor DAS applications, the DCC Series™ DAS Carrier Conditioners.  These products are equally suited for passive DAS venues and for active fiber DAS installations. DCC Series™ DAS interfaces allow for a wide variety of configurations, starting from simple two-port combining, to multi-carrier multi-band systems with integrated low pim, high power attenuators plus variable attenuators and monitoring ports.